Printed circuit board series

This circuit board series has various types for different application scenarios. Firstly, this series contains circuit boards with different layers and thicknesses, ranging from 36-layer IC test substrates to 4-layer FPCs, covering a wide range of layer and thickness requirements. Secondly, the choice of materials and copper thicknesses makes this series of boards offer good performance and reliability. The use of high-performance materials, such as HI-TG FR4 and Thinflex materials, as well as appropriate copper thicknesses, ensures the stability and reliability of the boards for demanding application environments. In addition, the low minimum line width, minimum aperture and minimum line spacing requirements make this series of circuit boards suitable for fine circuit design, and can meet the needs of product designs that require a high level of circuit detail. Finally, the use of immersion gold surface treatment improves the board's corrosion resistance and connectivity, ensuring stability and reliability in long-term use.